Pâte thermique Akasa Performance Compund 455

AK-455-5G is a formulated thermal compound designed to improve heat transfer between the CPU and heatsink. The grey paste offers a thermal conductivity of 2.4 W/m·K and comes in a 5 g package, enabling more efficient cooling and stable thermal contact for CPUs and other heat-generating components. The product is RoHS compliant and supplied with a spreader card and multi-language instructions.

Advantages

The compound provides high thermal conductivity (2.4 W/m·K) and low thermal resistance to maximise cooling efficiency. Its viscosity (approx. 76 cPs) allows for controlled application, and the included spreader card simplifies even distribution. Supplied in a compact 5 g tube and compliant with RoHS standards.

Suitable for (tasks / use cases)

• Thermal interface between CPU and heatsink in desktop and small form-factor PCs
• Heat transfer for GPUs, chipsets and other electronic components requiring improved thermal contact
• System repairs, upgrades and new builds where efficient cooling is needed

Key specifications

• Thermal conductivity: 2.4 W/m·K
• Weight: 5 g (0.005 kg)
• Viscosity: ~76 cPs
• Operating temperature range: -45 °C to 240 °C
• Colour: Grey
• Compliance: RoHS

How to use

Ensure both the CPU and heatsink mating surfaces are clean and dry. Apply a small amount of the thermal compound to the centre of the CPU die or cooler contact plate and use the included spreader card to create a thin, even layer. Reattach the heatsink according to the manufacturer’s mounting instructions and tighten mounting hardware evenly to avoid air gaps. Clean off old compound fully before reapplying during maintenance or upgrades.

Recommendations

For best results, use the compound sparingly — a thin, uniform layer achieves optimal thermal transfer. Avoid over-application which can reduce performance. Store the product at room temperature and keep the cap sealed to prevent drying.